Honor is reportedly working on the Magic 8 series of flagship phones for the Chinese market. It is speculated that flagship phones powered by the Snapdragon 8 Elite 2 will break cover by the end of September in China. Therefore, the Magic 8 series, which is expected to feature the said chipset, is also expected to debut in September.
Honor Magic 8 key specifications tipped
According to the leak, the alleged Honor Magic 8 will feature a flat 6.58-inch display with a 1.5K resolution and 2.5D glass. The screen design will include large-radius corners and slim bezels. To recall, the tipster previously claimed that the thickness of the black border would be less than 1mm. The new leak also states that the screen will be integrated with an ultrasonic in-display fingerprint sensor.
The device is also expected to support wireless charging and carry an IP68/69 rating for water and dust resistance. Interestingly, the current prototype unit is said to be equipped with a periscope telephoto camera, pointing to advanced imaging capabilities even on the standard variant. To recall, last year’s Honor Magic 7’s rear camera setup included a 3x telephoto camera.
While full hardware specifications haven’t been confirmed yet, the tipster remarks that the “core specs are decent,” hinting at a flagship-level performance package, likely featuring a Snapdragon 8 Elite 2 chipset.
Speaking of the Snapdragon 8 Elite 2, it is expected to launch by late September this year. It is speculated that the Honor Magic 8 series featuring the new chip will also debut by the end of September in China. At present, there is no information about the Honor Magic 8 series’ global launch.
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